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Jomar Amistoso

Freelance Technical Writer & Editor

2163
Location:Melbourne, Victoria, Australia
Website: https://sites.google.com/site/jomarshomepage/
Profile:https://www.freelanced.com/jomaramistoso
9
Kudos
4.5
2 Skills
$5
Rate/Hr
Name: Jose Omar Amistoso
Birthdate: December 16, 1973
Email: jomar.amistoso@gmail.com
Webpage: http://sites.google.com/site/jomarshomepage/home

Educational Attainment:

PhD Materials Science and Engineering (November 2007)
University of the Philippines, Diliman

M.S. Materials Science and Engineering
University of the Philippines, Diliman (October 1999)

B.S. Applied Physics
University of the Philippines, Diliman (May 1996)

PhD. Dissertation- Phenomenological Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer Level Solder Bumps

M.S. Thesis- Pulsed LASER Deposition of TiN on Si (100)

B.S. Thesis- Construction and Characterization of a Prototype Sealed-off CO2 LASER

Work Experience:

Development Reliability Manager
CPA, ST Microelectronics (February 2009- present)
Scope:
- Initiate, plan and lead worldwide package specifications and moisture sensitivity level assessment alignment
Plan and lead reliability programs for new products as part of product development
Develop test methodologies to determine acceleration factors and lifetime models for new products
Plan and lead reliability and failure analysis competency enhancement in support of new products

Reliability Physics Manager
CPA (Corporate Packaging and Automation), ST-NXP Wireless, Philippines (August 2008- February 2009)
Scope:
- Initiate, plan and lead worldwide package specifications and moisture sensitivity level assessment alignment
Plan and lead reliability programs for new products as part of product development
Develop test methodologies to determine acceleration factors and lifetime models for new products
Plan and lead reliability and failure analysis competency enhancement in support of new products

Reliability Physics Manager
NXP Semiconductors Philippines Inc (September 2006- August 2008)
Scope:
- Initiate, plan and lead worldwide package specifications and moisture sensitivity level assessment alignment
Plan and lead reliability programs for new products as part of product development
Develop test methodologies to determine acceleration factors and lifetime models for new products
Plan and lead reliability and failure analysis competency enhancement in support of new products

Senior Reliability Physics Engineer
IMO Backend Innovation, Philips Semiconductors Philippines Inc. (August 2005- September 2006)
Scope:
- Formulate qualification strategies for advanced package development, focusing on wafer-level interconnects such as CSP’s, underbump metallization and solder bumps.
- Qualify advanced flip-chip-based packages for RF and mobile communication applications.
- Characterize the reliability of wafer-level and flip-chip based interconnect technologies and determine the activation energies of observed failure modes, in order to calculate the MTTF of these devices
- Perform failure analysis on reliability failures and coordinate failure analysis with external laboratories.

Senior Materials Engineer
IMO Backend Innovation, Philips Semiconductors Philippines Inc. (October 2004- August 2005)
Scope:
- Evaluate and qualify new materials and alternative material suppliers for advanced package technologies.
- Spearhead Pb-free conversion activities for IMO Backend businesses at PSPI.
- Provide technical knowhow on solder-based interconnects and electroless Ni/Au underbump metallization plating processes in support of production and new products.

Senior Manufacturing Engineer
PerkinElmer Optoelectronics, Philippines Inc. (May 2003- October 2004)
Scope:
- Evaluate and qualify new materials and concepts for new product introduction.
- Evaluate new processes in support of new products in preparation for customer sample requests and mass production
- Spearhead Pb-free conversion activities at PerkinElmer Optoelectronics

Failure Analysis and Reliability Engineer
PerkinElmer Optoelectronics, Philippines Inc. (April 2002- May 2003)
Scope:
- Determine the root cause of customer failures and production failures.
- Develop test methodologies to determine acceleration factors and lifetime models for new and existing products
- Coordinate failure analysis with external laboratories and academic institutions.
- Formulate qualification programs for leadframe-based, substrate-based, and metal-can optoelectronic devices in support of production and new product introduction.

Assistant Professor
Mapua Institute of Technology (October 2000- April 2002)
Scope:
- Conduct classes on Materials Science and Engineering as a general engineering course to engineering students.
- Setup the B.S. Materials Science and Engineering program, by formulating course syllabi and purchasing laboratory equipment such as (DSC, TMA, TGA)

University Research Associate
University of the Philippines, (June 1997- October 2000)
Scope:
- Conduct multidisciplinary research based on optoelectronics and light-matter interaction.
- Active involvement in PCASTRD/DOST-based research projects such as:
o The development of a 2-photon confocal microscope
o Pulsed LASER Deposition of thin films
o LASER-Induced Plasma Spectroscopy for materials analysis
o Optical characterization of Erbium-dope glasses for optical telecommunications applications

Graduate Assistant
National Institute of Physics, University of the Philippines, (June 1996- June 1997)
Scope:
- Conduct studies to quantify the chaotic behavior of rat microcirculation.
- Perform basic studies of light-matter interactions

International Publications:

Measurement of weak transmittances by stochastic resonance, A. Palonpon, J.O. Amistoso, J Holdsworth, W. Garcia, C. Saloma, Optics Letters, Vol. 23, No. 18 (1998)

High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material, J.O.S. Amistoso and S. Kawata, Molecular Crystals and Liquid Crystals, Vol.344 (2000)

Effect of Saturable Response to 2-Photon Absorption on the Readout Signal Level of 3-Dimensional Bit Optical Data Storage in a Photochromatic Polymer, M. Gu, J.O.S. Amistoso, A. Toriumi and S. Kawata, Applied Physics Letters, Vol. 15 (2001)

3µm Layer Interval, 50 Layer, 3D Rewritable Digital Optical Data Storage, S. Kawata and J.O.S. Amistoso, Proceedings of the Japan Society of Applied Physics 47th Spring Meeting (2002), p. 1174

Characterization of a confocal Microscope Readout System in a Photochromic Polymer under Two-Photon Excitation, J.O.S. Amistoso, Min Gu, Satoshi Kawata, Japanese Journal of Applied Physics , Vol. 41 No. 8 (2002)

Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer-Level Solder Bumps, J.O.S. Amistoso, A. V. Amorsolo, IEEE Transactions on Components and Packaging Technologies, Vol. 32 Issue 2 (2009), p. 405-414

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solders, J.O.S. Amistoso, A.V. Amorsolo, Journal of Electronic Packaging, Vol. 131 Issue 4 (2009)

Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth, J.O.S. Amistoso, A.V. Amorsolo, Journal of Electronic Materials, Vol. 39 No. 10 (2010)

Local Publications:

Pulsed 1064 nm Nd-YAG Laser Deposition of Titanium on Silicon in a Nitrogen Environment, Jose Omar Amistoso, Edgardo Pabit, Marilyn Hui, Wilson Garcia, Science Diliman, Vol. 11 No. 2 (1999)

International Conferences:

High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material, J. O. Amistoso and S. Kawata, Proceedings of ISOM 2000, pp.166-167 (Chitose, September, 2000).
Determination of Intermetallic Growth Activation Energy and the Effect of Time and Temperature on Shear Strength in Flip-Chip Devices, J.O.S. Amistoso, Nhoy Lacson Proceedings of 9th IPC/JEDEC International Pb-free Conference, Aug. 17-19, 2005.

A Comparative Study of the Effect of Bond Pad Opening on Solder Bump Reliability, O. Alvarez, J.O.S. Amistoso, Proceedings of 10th IPC/JEDEC International Pb-free Conference, Oct. 8-9, 2006

Patents:

Solder Resist Dam Design for Chip-on-Board Applications, Philips ID# 690106

Electric Component with Under-Bump Metallization and Integrated Confinement Structure, (WO/2010/032192), US/European Patent

Training/Work Experience:

Training at the Laser Physics Laboratory of the National Institute of Physics

Design and construction of high vacuum systems for pulsed laser deposition (PLD) and laser induced plasma spectroscopy (LIPS) systems

Hands-on operational experience on:
1. optical spectroscopy (fluorescence spectroscopy, multiphoton spectroscopy and imaging, laser induced plasma spectroscopy- LIPS)
2. lock-in amplifiers
3. boxcar averagers
4. pulsed Nd-YAG + MOPO tunable lasers
5. He-Ne lasers
6. diodes lasers
7. interferometers
8. high pressure Raman cells for Stimulated Raman Spectroscopy
9. high vacuum systems
10. Labview programming

Hands-on failure analysis (decapsulation, cross-sectional analysis) and reliability experience (HTRB, HTOL,TMCL, HTSL, UHST) on optoelectonic devices

ISO9001/TS16949 internal company auditor, PerkinElmer Optoelectronics LISP, Cabuyao Laguna, 2003-2004

QMS internal company auditor, PerkinElmer Optoelectronics LISP, Cabuyao Laguna, 2003-2004

Part of the Wafer-Level Electroless NiAu Bumping team (Philips Semiconductors Cabuyao) to set-up the very first wafer-level bumping line in the Philippines.

Reliasoft Training –Weibull, Alta++

Involvement in Externally Funded Research Projects:

Research specialist of the NRCP-funded project entitled Bifurcation and Chaos in the Microcirculation of Rats, June 1996-June 1997 (UP Diliman)

Design and Construction of a Tunable Two-Photon Confocal Microscope, PCASTRD funded research project, 1998 (UP Diliman)

Sampling, Resource Estimation and Study of Silica Sand Deposits for the Foundry Industry in Dumaran Bo. Barbacan and Brgy. San Miguel in Northern Palawan, Philippines, CHED funded research project from November 2000- November 2001 (Mapua Institute of Technology)
Skills (2) Rating
Technical Writing
Editing